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Mediatek uses TSMC’s 2NM process for new flagship chips

Mediatek Inc., Taiwan’s largest chip designer, said Tuesday it has adopted the advanced 2nm process of Taiwan Semiconductor Manufacturing Corporation (TSMC) – which will enter mass production in the second half of this year – to build its next flagship system (SOC) on CHIP (SOC).

Mediatek said in a statement that the SOC has completed the tape phase, where the final design is sent for manufacturing preparation and is expected to be available by the end of 2026.

Although the company did not name the chip, international media reported that it could be Mediatek’s next-generation mobile flagship store, Dimenty 9600, as part of its strengthening of its global position in cutting-edge semiconductor technology.

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Taiwan Taiwan report said that the company’s partnership with TSMC has enabled its flagship chips to deliver high efficiency and provide solutions for products from edge applications to cloud services.

MediAtek and TSMC have long been working on mobile platforms, computing, automotive electronics and data centers, according to the company. It says the new SoC highlights the power of their relationship.

Kevin Zhang, deputy co-president of business development and global sales, said the 2NM process marks TSMC’s entry into the nanosheet transistor structure, highlighting its commitment to meet customer needs by upgrading technology and improving computing performance and energy efficiency.

Zhang added that the partnership with MediAtek reflects TSMC’s ambition to support widespread use.

MediAtek is one of several companies that adopt TSMC 2NM nodes. Other notable customers – including Apple Inc., Nvidia Inc. and Advanced Micro Devices Inc. (AMD) – are also expected to release products built using the technology.

TSMC said on its website that the 2NM process will be the world’s most advanced density and energy efficiency, thus providing full-node improvements in performance and power consumption.

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